The new profile sensor Z-Trak 2 of Teledyne Dalsa delivers scan speeds of up to 45,000 profiles per second and features built-in HDR and reflection compensation algorithms to handle surfaces with varying degrees of reflectivity in a single scan. Offering 2K points per profile, all models are factory calibrated and offered with either blue or red lasers to suit various surface properties and operating environments.
Turck’s TIV (Turck Intuitive Vision) AI camera processes image data locally and in real time.
Sony Semicon’s Multi Aperture Computed Tomography Imaging Spectrometer (MACTIS) is a snapshot capable hyperspectral camera.
Cubert’s open-source, low-code Cuvis AI software ecosystem enables hyperspectral imaging and AI with practical applications across various industries.
Optris announces four new infrared application packages that expand the capabilities of the Xi camera series.
Coherix introduces 3D Lateral Tracking, a new technology integrated into the company’s 3D inline inspection system for adhesive bead detection.
The CoaXPress standard is an interface for downstream transmission of high-speed data streams, slower control data, and DC power via a common…
With the Control fair now moving to a two-year cycle, the next edition won’t take place until 2027.
