Opto Engineering’s PCMP series of multi-image 3D objectives are for measuring test objects from 1 to 10mm. An array of mirrors connected to a bitelecentric lens provides six side views. These can be used to measure components from different angles.
Turck’s TIV (Turck Intuitive Vision) AI camera processes image data locally and in real time.
Sony Semicon’s Multi Aperture Computed Tomography Imaging Spectrometer (MACTIS) is a snapshot capable hyperspectral camera.
Cubert’s open-source, low-code Cuvis AI software ecosystem enables hyperspectral imaging and AI with practical applications across various industries.
Optris announces four new infrared application packages that expand the capabilities of the Xi camera series.
Coherix introduces 3D Lateral Tracking, a new technology integrated into the company’s 3D inline inspection system for adhesive bead detection.
The CoaXPress standard is an interface for downstream transmission of high-speed data streams, slower control data, and DC power via a common…
With the Control fair now moving to a two-year cycle, the next edition won’t take place until 2027.
