The FSM-IMX811 from Framos is the first sensor module available on the market based on the Sony IMX811, a large-format CMOS sensor with 247 effective megapixels. The module comes with a development kit containing hardware, documentation, and a validated reference design supporting the AMD development board.
Turck’s TIV (Turck Intuitive Vision) AI camera processes image data locally and in real time.
Sony Semicon’s Multi Aperture Computed Tomography Imaging Spectrometer (MACTIS) is a snapshot capable hyperspectral camera.
Cubert’s open-source, low-code Cuvis AI software ecosystem enables hyperspectral imaging and AI with practical applications across various industries.
Optris announces four new infrared application packages that expand the capabilities of the Xi camera series.
Coherix introduces 3D Lateral Tracking, a new technology integrated into the company’s 3D inline inspection system for adhesive bead detection.
The CoaXPress standard is an interface for downstream transmission of high-speed data streams, slower control data, and DC power via a common…
With the Control fair now moving to a two-year cycle, the next edition won’t take place until 2027.
