At the SPS, Contrinex presented a smart 3D camera that will be released in Q2/25. The time-of-flight camera with QVGA resolution (320×240 pixels) and a working range of 300 to 3,500mm communicates directly with the company’s iOS and Android companion app so that predefined application-specific algorithms can be used. Only 5-10 sample images are needed to learn the respective application.
Turck’s TIV (Turck Intuitive Vision) AI camera processes image data locally and in real time.
Sony Semicon’s Multi Aperture Computed Tomography Imaging Spectrometer (MACTIS) is a snapshot capable hyperspectral camera.
Cubert’s open-source, low-code Cuvis AI software ecosystem enables hyperspectral imaging and AI with practical applications across various industries.
Optris announces four new infrared application packages that expand the capabilities of the Xi camera series.
Coherix introduces 3D Lateral Tracking, a new technology integrated into the company’s 3D inline inspection system for adhesive bead detection.
The CoaXPress standard is an interface for downstream transmission of high-speed data streams, slower control data, and DC power via a common…
With the Control fair now moving to a two-year cycle, the next edition won’t take place until 2027.
